This full kit supports BLDC motors from 12 V to 48 V with power up to 1000 W, or up to 20 V and 100 W using the micro USB-C cable.

The set-up is fast and easy because you simply bring together the 3-phase inverter, motor control and microcontroller development boards, before you add the BLDC motor and power source. Then you are ready to start implementing your BLDC motor design.

Use the Motor Driver Kit to validate MOSFETs across multiple drive methodologies. The modular kit also gives you the freedom, and the files, to create a new BLDC motor, or adapt an existing design.

Time is saved because the kit includes pre-flashed firmware, and easy adaptability means that you can set your own preferences. Project customization is simplified because all of the resources are open source and the firmware is also available on GitHub.

With the flexibility of the NEVB-MTR1-KIT1, the MOSFETs, drivers and controllers can be swapped out to provide the scalability for multiple use cases.

Current sensing and fault detection are supported by the Motor Driver Kit, and the trapezoidal control of brushless DC (BLDC) motors uses Hall effect sensors firmware.

The efficient power delivery is based on the Nexperia LFPAK56 MOSFETs and NGD4300 gate drivers, and there are built-in test points to streamline debugging. These test points are for power, motor drive, and sensing signals, to speed development and testing.

The microcontroller development board is a Leonardo R3 and the motor driver kit is also compatible with STM32 Nucleo boards.

Request a free Nexperia Motor Driver Kit from the FTM Board Club now.

To meet new and existing energy standards, CUI Inc has introduced an energy-efficient ac-dc desktop adapter, in addition to adding a power boost option to board-mount ac-dc power supplies which can be used to double the rated current in space-constrained applications. For dc-dc conversion, efficiency up to 90% is achieved by an encapsulated 30 W dc-dc converter which also offers 4:1 input voltage.

The energy efficiency of the SDI36-U desktop ac-dc power supply simplifies meeting the new UL/cUL 62368-1 standard which covers infocomm technology (ICT) and audio visual (AV) equipment. With no-load power consumption of under 0.075 W, the SDI36-U power supply also supports the existing US DoE Level VI standard as well as the proposed EU CoC Tier 2 standard.

The new power boost option offered by two board-mount open-frame ac-dc power supplies can double the rated current and simplify design for applications where space is tight. The 25 W VOF-S25B, and 60 W VOF-S60B open-frame ac-dc power supplies support large transient loads with the power boost option. This feature also means that the application can be designed to operate at nominal power, rather than at peak power, as the rated output power can be boosted for up to 10 seconds and with a repeated duty cycle of 10%.

Low-power information technology equipment (ITE), as well as industrial and consumer applications, can benefit from this power boost option.

Efficiency is also crucial for dc-dc conversion, and the encapsulated PDQ30-D 30 W isolated dc-dc converter combines efficiency of up to 90%, with a 4:1 input voltage, and a low-profile package with an industry-standard 1” x 1” footprint. The temperature range of -40°C to 105°C also makes the PDQ30-D suitable for convection cooling. In addition datacom, telecom, remote sensor systems and portable electronics, the PDQ30-D can be used to support microcontrollers.

Click here to request FREE samples of these products.

For more information on the four products, either click the links above, or explore our Spotlight which has more information.

The EliteSiC families offer higher efficiency and improved power density which translate into more efficient and compact power converters. Reliable supply of SiC devices is ensured by vertically integrated SiC manufacturing.

EliteSiC components such as power modules, MOSFETs and diodes are application optimized to meet the highest demands of different power-hungry applications.

The three generations of EliteSiC MOSFETs: M1, M2, M3 show progression in technology and manufacturing. Each generation has improved upon substrate layout thus improving unit cell density and reducing parasitics. The net effect is continuous reduction in the specific on-resistance (R_SP).

The newest M3 technology has been split into two application−specific products: M3S and M3T. The M3T is designed to meet motor control and traction inverter requirements while M3S provides an ultra−low R_SP along with best in class switching losses (E_TOT). This makes M3S well suited for high−speed applications such as on−board chargers (OBCs) and high voltage DC/DC converters.

For industrial, energy storage and EV charging, EliteSiC not only boosts performance, but also can reduce system size, weight and improve cooling. On board chargers can benefit from balance between conduction and switching losses, making EliteSiC ideal for Power Factor Correction (PFC) and DC/DC switching applications like LLC, CLLC and Phase Shifted Full Bridge.

Design flexibility is increased with the range of packages, which include TO-247-4L with Kelvin source utilizing full benefits of SiC. Additionally, TO-247 3L, D2-PAK-7L and the top-cooled surface-mount BPAK.

For fast switching at high voltage and high temperature, the EliteSiC Schottky diodes maintain high efficiency and also feature zero reverse-recovery charge, low forward voltage and temperature-independent current stability.

To increase thermal performance and achieve higher power density, the compact and lightweight EliteSiC modules integrate SiC FETs and diodes and are rated for voltage from 650 V up to 1200V.  The modules feature transfer molded packages, in addition to packages which have gel encapsulated cases to add reliability.

The combination of the features and robust design of EliteSiC MOSFETs, power modules and Schottky diodes, reduces design risk, and enables greater control across a range of applications.

That is why SCHURTER has released the world’s first appliance connectors, which are manufactured with bio-based plastic rather than traditional oil-based plastic.

According to a study commissioned by myclimate, the highest CO₂ emissions are caused by the material used in the manufacture of a component. To address this challenge, SCHURTER has launched Green Line appliance connectors in a bio-plastic housing which is made from plant-based raw materials.

The change to bio-based plastic can reduce emissions by up to 68% compared with traditional oil-based plastics, which are made from petrochemicals. At the same time, the connectors must continue to maintain the same standards of visual and mechanical quality.

The raw material which is used to produce the bio-plastic for the Green Line connectors is produced from castor beans. The bio-plastic is recyclable and has a CO₂ footprint which is neutral over the entire life cycle. As the bio-based plastics often have a lower density compared with oil-based plastics, there is also a reduction in the amount of raw material that is used.

The extraction and production of the bio-plastic from castor beans is sustainable and minimizes the need for energy. The fact that castor bean plants can be grown in dry regions is different from using raw materials such as corn or sugar to produce bio-plastics. This is because castor bean plants do not compete for land, which is needed for conventional agriculture, as the plants can grow in dry regions and without needing fertiliser or artificial irrigation. In addition, the castor bean plants absorb and bind CO₂ from the atmosphere during cultivation.

The plant-based plastic made from castor beans also has the ability to be recycled and reused to support long-term sustainability.

To provide design flexibility, there are 77 variants of the Green Line IEC 60320-compatible appliance connectors across six series. These series offer screw-on or snap-in mounting for the 6100 and 6102 series of C14 and C18 appliance inlets, and for the 6600 series of F outlets. The mounting options also add the option of using solder or quick-connect terminals.

As part of the SCHURTER strategy for sustainability, the Green Line eco-friendly appliance connectors play a significant role in contributing to the goal of cutting 50% of the CO2 footprint by 2035. The connectors also help the manufacturers of appliances to lower CO₂ emissions.

As an alternative, a dc-dc converter can be connected to the main output rail to provide a secondary regulated output. But now the circuit performs two-stage conversion rather than single-stage, resulting in substantially lower conversion efficiency. What’s more, the addition of the dc-dc converter adds to bill-of-materials cost and increases the circuit’s board footprint.

So this is why the options for creating a multi-output ac-dc converter have been fairly described as unattractive.

No longer however: with the introduction of the Power Integrations InnoMux-2 ac-dc converter IC, power system designers can produce two or three outputs from a single-stage flyback conversion circuit, with regulation on all outputs of better than ±3%, and total conversion efficiency higher than 90%. It’s suitable for power supplies which are rated for loads up to 100 W.

The operation of the InnoMux-2 converter takes advantage of some clever innovations by Power Integrations which enable two or three independent feedback circuits to direct energy through the transformer separately to each power rail. As with the first-generation InnoMux converter IC, the secondary feedback signal is transferred via the unique FluxLink technology to the primary side, eliminating the need for an expensive optocoupler in the flyback converter.

Now, by using InnoMux-2, designers can implement accurately regulated multi-output ac-dc power supplies with a single converter IC, greatly reducing component count while increasing efficiency by as much as 10% compared to two-stage conversion architectures.  Efficiency is aided by the ICs’ 750 V PowiGaN gallium-nitride transistors, zero-voltage switching (without an active clamp) and synchronous rectification.

Flexible output options include up to three independently regulated voltage outputs, or two voltage outputs and a constant current output, which may be used for instance for driving backlight LEDs for a display, or for high-speed battery charging. This capability makes the InnoMux-2 ideal for products including TVs, monitors, appliances, networking equipment, home and building automation, LED emergency lighting, and industrial power supplies.

Designers can start working with the InnoMux-2 now by evaluating reference designs created by Power Integrations – a 52 W power supply for a TV (DER-714), a 23 W power supply for a monitor (DER-715), or a 62 W industrial or appliance power supply with three voltage outputs (DER-716).

Or contact a Future Electronics Power Specialist Engineer for more information about how to integrate the InnoMux-2 converter in your multi-output flyback converter design.

In addition to its stunning AI performances, the latest STM32MP2 microprocessors from STMicroelectronics support advanced graphics for HMI, and strong security.

The industrial qualification of the STM32MP2 includes the ability to deliver 100% operation for 10 years, with the 10-year longevity commitment being renewed every year.

Integrating edge AI accelerators with a neural processing unit (NPU), the STM32MP2 microprocessors achieve up to 1.35 trillion operations per second (TOPS). The versatile allocation of resources between cores enables AI workload to be shared efficiently between the NPU, the central processing unit (CPU), or the graphics processing unit (GPU).

With single or dual Arm^® Cortex^®-A35 cores, operating at up to 1.5 GHz, and an Arm Cortex-M33 core operating at up to 400 MHz, the STM32MP25 microprocessors can run these cores independently and in parallel. This means that real-time functions can be run in parallel with the multimedia capability.

A Resource Isolation Framework (RIF) extends isolation for multi-core and multi-applications so that an isolated peripheral accesses the processor only when it is required.

For advanced HMI, the 3D GPU supports up to 1080p resolution and provides the full HD video pipe with RGB, LVDS and DSI outputs interface.

For efficient image acquisition, in addition to processing multiple outputs, the STM32MP2 integrates a MIPI CSI-2 camera interface with an internal image signal processor (ISP). This allows more flexibility and cost savings on image sensor selection while totally offloading the CPU from management of multi-channel application scenarios.

To maintain security for industrial edge applications, certification is planned to SESIP3 and PSA Level 1, and TrustZone^® provides secure boot, as well as secure firmware updates and cryptography. A secure provisioning ecosystem is also available.

Support for fast AI development includes the X-LINUX-AI all-in-one expansion package for OpenSTLinux The STM32 Modelzoo, available on Github, is a selection of application-oriented models for human pose estimation, computer vision models for image classification, semantic segmentation, and object detection

The combination of artificial intelligence, with advanced graphics and strong security, enables the STM32MP2 microprocessors to deliver AI for secure industrial-grade advanced edge applications.

As usual with the STM32MPU products, the SMT32MP2 can rely on a strong ecosystem including the OpenSTlinux distribution, the expansions packages (eg X-LINUX-AI or X-LINUX-TSNSWCH) to enlarge the functionalities (AI or embedded ethernet switch), STM32 tools and partners (System On Module, Graphics, services). Note that the OpenSTLinux BSP is now declined via Buildroot, OpenWRT and Android Flavors.

Request a free board: STM32MP257F-EV1 – FTM Board Club (my-boardclub.com)

To drive this growth, five series of microcontroller controllers have been launched by NXP to bring processing power, efficiency and security to the secure connected edge.

As one of the first general-purpose microcontrollers to embed a true neural processing unit (NPU), the MCX-N microcontrollers were launched in January 2024. The MCX-W microcontrollers support Matter and other wireless protocols, in addition to delivering advanced security and hardware accelerators.

For entry-level and cost-sensitive edge applications, there are the MCX C microcontrollers, and the MCX A microcontrollers which combine smart peripherals with scalable memory and packages. These features are designed to boost smart applications in home control, appliances and motor control.

Wearables and other power-conscious applications at the connected edge, are also targeted with the ultra low-power MCX L microcontrollers which have the lowest active power consumption and leakage, as well as essential security features.

To drive artificial intelligence (AI) and machine learning (ML), the neural processing unit in the MCX N runs AI and ML while the Arm® Cortex®-M33 core runs the rest of the application. The machine learning performance of the MCX N achieves around 30x more throughput compared to the Arm Cortex-M33 core. ML can be used to monitor the state of the system and machine health, in addition to recognising normal and abnormal activity. The dynamic power consumption compares with ultra low-power microcontrollers, and power efficiency is optimized by the autonomous peripherals which minimize core overhead.

To support AI with advanced cyber security, the EdgeLock 2GO is pre-integrated to handle over-the-air key management, and has a root of trust, and hardware-accelerated cryptography.

Offering an NPU for AI and ML, advanced connectivity to handle Matter, and ultra low-power options for entry-level and cost-conscious applications, the five series of MCX microcontrollers offer the basis for the growth in the secure connected edge.

For an out-of-the-box experience for rapid protoyping of the MCX N microcontrollers, request a free FRDM-MCXN947 board: FRDM-MCXN947 – FTM Board Club (my-boardclub.com)

To disconnect the compact circular push-pull connectors, the operator pulls the outer shell sleeve which retracts the inner spring-action latch allowing the connector to be de-mated.

In addition to delivering the security of push-pull latching, the shielded connectors handle frequent mating and un-mating, and suit indoor or outdoor applications.

To add to the durability and reliability, the push-pull connectors offer protection to IP50 or IP68. The connectors with a metal shell provide full EMI and RFI shielding, and are rated to handle 5,000 mating cycles over a temperature range from -55°C to 200°C. The connectors with a plastic shell support over 1,000 mating cycles and operate over a temperature range from -55°C to 150°C.

And there are more advantages. With IP50 protection, the miniature 00 series metal connectors have an ultra-compact 7 mm diameter, and there is the best-selling B series metal connectors in a standard shell format. In a plastic shell, the P series also has a standard geometry and is commonly used in medical applications.

For waterproof connections, the K and T series metal shell connectors offer IP68 sealing. The K series connectors integrate an extra sleeve, and the newer T series is based on a standard geometry.

To deliver rugged reliability, the push-pull connectors withstand vibration to 15 g, from 10 Hz to 2,000 Hz, to support applications in test houses, as well as shock resistance of 100 g for 6 ms.

The option of cable or panel-mount connectors offers flexibility in application, in addition to gold-plated solder cup contacts which increase the efficient soldering of wires. Offering from 2 to 34 contacts, and with current rating up to 30 A, the push-pull connectors automatically include a strain relief boot where configured, and adds keying or color to differentiate the connectors when multiple connectors are used in the same application.

Compatible with existing industry solutions, the MH push-pull connectors are on a short manufacturing lead time of 6 to 8 weeks which supports fast prototyping and design.

Request a free sample of a self-latching push-pull MH Connector from Future here

MH Connectors is part of the EDAC group of companies

The compact and pulse-resistant fuses from SCHURTER save space and simplify production by being compatible with automated assembly.

To protect against over-currents and short-circuits, the fast-acting UMF 250 fuses have a breaking capacity of up to 500 A, and handle current from 500 mA to 15 A. The interruption speed is enabled by low melting points. These low melting points also allow heat to be thermally conducted away from the fuse after heat is generated during a surge.

The anti-surge time-lag UMT 250 fuses handle pulse-shaped continuous currents with a 200 A breaking capacity and have a T speed rating. The extremely compact fuses measure 3 mm x 10.1 mm and have current ratings from 80 mA to 10 A.  The UMF 250 and UMT 250 fuses are rated for voltage of 250 V ac, 125 V dc.

To enable easy replacement on the board after soldering, the clip-mounted time-lag UMZ 250 and quick-acting UMK 250 are designed to the IEC 60127-4 standard for miniature fuses. With 18 (10) different current ratings the UMZ 250 (UMK 250) fuses add a T time-lag (quick-acting) rating to a breaking capacity of 200 A at 250 V ac. The UMZ fuses are UL approved for 80 mA to 4 A current – the UMK fuses for 50 mA to 4 A current – all at 277 V ac and 250 V dc.

The surface-mount time-lag UMT 250/UMZ 250 fuses can be used to protect medical equipment as well as for battery protection. The fast-acting UMF 250/UMK 250 fuses also provide protection for power supply and illumination.

Buy Now:

• UMK 250

• UMF 250

• UMZ 250

• UMT 250

With the SLG47910V ForgeFPGA, mass market applications such as wearables and battery-powered devices can access the lowest cost, low-density FPGA, which also achieves the lowest sleep current. High integration is also built in to the extremely small footprint.

ForgeFPGA introduces a new approach as a one-time programmable (OTP) low-density FPGA. OTP is not usually available on a low-density FPGA, but the factory programming on ForgeFPGA eliminates the cost and logistics of programming, and adds custom part numbering at no additional cost.

The structure of the SLG47910V ForgeFPGA features an advanced 6-input 2-output look-up table (LUT). There is also a unique power-gating structure which enables the ultra-low sleep current.

The key performance advantages of the ForgeFPGA can benefit glue logic, protocol conversion and data aggregation and pipelining applications, particularly where there is highly-parallelized digital logic and the combining of sensor data.

To enable high-volume applications to accelerate ForgeFPGA, the software is easy to use and license-free with the Go Configure Software Hub.

Request the free ForgeFPGA development kit now by clicking the link