Evaluation kit for automotive SiC modules in main inverter applications
To benefit from using automotive SiC modules in main inverter applications, start your development with the Infineon evaluation kit for HybridPACK™ Drive Gen2 CoolSiC™ power modules.
The HPD G1 SIC evaluation kit integrates an FS03MR12A6MA1B HybridPACK™ Drive Gen2 power module, with a reference aluminum cooler and recommended sealing ring. The kit also includes the HPD GD BOARD G1 SIC, gate driver board and a dc-link capacitor.
The FS03MR12A6MA1B HybridPACK™ Drive Gen2 six-pack module is very compact and is rated for 1,200V voltage and 400A current, in addition to being optimized for hybrid and electric vehicles.
Featuring higher temperature cycling, and integrated diode temperature sensors, the FS03MR12A6MA1B module offers a lower system bill-of-materials (BoM) in addition to lower AC contact resistance and adds PressFIT contact technology.