Industrial

Renesas

The ZSSC3286KIT evaluation kit from Renesas provides the hardware needed for the configuration, calibration, and evaluation of the IO-Link ready ZSSC3286 sensor signal conditioner (SSC) IC. 

The user’s PC can communicate via USB with the ZSSC3286 IC on the ZSSC3286 evaluation board via IO-Link, using the included RH4Z2501-PMOD board, an IO-Link physical layer transceiver board with a Pmod™ interface, and the 2-channel IO-Link master. 

The ZSSC3286 evaluation kit also contains a sensor signal conditioning communication board for configuration via an I²C interface.

The ZSSC3286KIT is an all-in-one evaluation system which includes:

  • ZSSC3286 evaluation board
  • SSC communication board
  • SSC sensor replacement board
  • CCE4510 IO-Link master board
  • RH4Z2501-PMOD board
  • Five ZSSC3286 samples
  • USB and IO-Link cables
  • Tweezers
  • Software including ZSSC3286 IO-Link Device Description generator
Infineon

This kit provides a development platform for the Sona™ IF513 module from Ezurio, which is based on the AIROC™ CYW55513 Wi-Fi 6/Bluetooth wireless chipset from Infineon. 

Key features: 

  • Antenna type: 2 x MHF4L connector for antenna diversity
  • Form factor: pluggable M.2 2230 E-Key 
  • Frequencies supported: 2.4 GHz/ 5 GHz /6 GHz
  • Wireless technologies: Wi-Fi 6E, Bluetooth 6.0



Infineon

The EVK-MAYA-W381 from u-blox provides a ready-made application environment for designers working with the MAYA-W381, a module which is based on the CYW55513 Wi-Fi 6/Bluetooth wireless chipset from Infineon. The module provides two external antennas for tri-band Wi-Fi 6/6E and Bluetooth 6.0 connectivity. 

 

Key features of the EVK-MAYA-W381 include:  

  • SD card adapters to access the SDIO host interface
  • USB interface to easily access the Bluetooth UART interface via a USB-to-UART bridge
  • Digital and analog audio interfaces for Bluetooth wireless networks 
  • SMA connectors for external antennas
  • GPIO pins and other module interfaces accessible through pin headers
  • Multiple power-supply options
Infineon

Evaluation board, EVAL-6EDL04I065PR, features Infineon’s latest silicon-in-insulator (SOI) EiceDRVIER™ gate driver IC, 6EDL04I065PR, and TRENCHSTOP™ Reverse Conducting (RC) IGBT, IKD06N60RC2, in a compact, cost-effective three-phase inverter bridge designed to drive a brushless direct current (BLDC) motor.

Infineon

Infineon´s XENSIV™ TLx5012B magnetic angle sensor 2GO kit is a budget-priced entry level evaluation kit equipped with a TLE5012B /TLI5012B digital GMR angle sensor interfaced with an  XMC1100 Infineon Microcontroller based on ARM Cortex M0 CPU.

Nexperia

The Nexperia NEVB-MCTRL-100 BLDC motor driver kit provides a full motor drive solution for 12 V to 48 V, three-phase brushless dc (BLDC) motors. 

The kit features PCBs designed for the Nexperia NextPower MOSFET family housed in an LFPAK56 package, and the modular design allows for different motor controllers, gate drivers, MOSFETs and motors to be used. In addition, each board provides convenient test points for power, motor drive, and sensing signals to aid with development and testing with the Nexperia LFPAK56 MOSFET family. 

The motor controller board is compatible with the Leonardo R3 and Nucleo development board form factors.

1 … 13 14 15 16 17 … 47