2-in-1 power modules reduce volume in multi-level inverters
The SCZ400x series from ROHM Semiconductor uses a 2-in-1 molded package to deliver high power density and flexible topology options for photovoltaic inverters, uninterruptible power supplies, and more energy systems.
ROHM has introduced the SCZ400x series of power modules which integrate 4th generation SiC MOSFET technology into the DOT-247 package. DOT-247 is a 2-in-1 molded module structure combining two dies to enable the use of larger chips than standard TO-247 footprints allow. This achieves a 15% reduction in thermal resistance and a 50% reduction in inductance compared to TO-247 components.
These improvements enable the SCZ400x series to deliver power density up to 2.3 times higher than equivalent TO-247 solutions in a half-bridge configuration, allowing designers to implement the same power circuitry in half the volume.
The series supports both half-bridge and common-source topologies, addressing demand for multi-level circuits such as three-level neutral point clamped (NPC), T-NPC, and five-level active NPC (ANPC) used in high-voltage photovoltaic systems.
The SCZ400x series includes 750V and 1200V options, with 750V power modules featuring on-resistance as little as 4mΩ and current capacity up to 251A, with 1200V modules offering resistance down to 6mΩ and up to 209A current.