Integrated matching network and filter optimized for STM32WL3 wireless MCUs

The STMicroelectronics MLPF-WL-xxD3 family integrates the multiple passive components required for matching and filter circuits for a sub-1 GHz radio into a single compact chip.

The STMicroelectronics MLPF-WL-xxD3 products, which integrate an impedance matching network and harmonics filter in a single chip, saves board space and improves performance in RF circuits based on the STM32WL3 series of wireless microcontrollers. The family consists of several variants, including the MLPF-WL-01D3, MLPF-WL-02D3, and MLPF-WL-03D3.

The matching impedance network has been tailored to get the best radio performance from the STM32WL3xxx ultra-low power, multi-protocol wireless MCUs. The MLPF-WL-xxD3 products use STMicroelectronics integrated passive device (IPD) technology on a non-conductive glass substrate, which provides for excellent RF transmission and reception.

The STM32WL3x line of MCUs, based on an Arm®  Cortex®-M0+ CPU core, operate in two frequency bands: 413 to 479 MHz, and 826 to 958 MHz. The MLPF-WL-xxD3 family includes dedicated filters for these different bands and power modes:

  • MLPF-WL-01D3: low-pass filter matched to the low-power 16 dBm mode in the 826 to 958 MHz frequency band
  • MLPF-WL-02D3: low-pass filter matched to the high-power 20 dBm mode in the 826 to 958 MHz frequency band
  • MLPF-WL-03D3: low-pass filter matched to the low-power 10 dBm mode in the 413 to 479 MHz frequency band

By integrating the matching network and filter into a single device, the MLPF-WL-xxD3 family enables RF designers to eliminate the use of discrete network and filtering components, reducing the circuit’s board footprint. 

The MLPF-WL-xxD3 products are supplied in a chip-scale package on glass with five bumps, and has a footprint of 1.47 mm x 1.87 mm.

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