Surface-mount packaging technology increases power density of dc-dc converter modules
3D Power Packaging® (3DPP) technology enables RECOM to build surface-mount power modules which have a small board footprint while supporting modern, efficient assembly processes.
The 3D Power Packaging technology for low-power dc-dc converter modules from RECOM enables electronic product manufacturers to gain the efficiency and automated production benefits of a surface-mount package style with the small board footprint of a through-hole package.
In traditional power-system designs, through-hole system-in-package dc-dc converters are used to minimize the PCB footprint, though they can complicate the assembly process, requiring the mixing of wave soldering or even hand soldering with the reflow process used for surface-mount components on the board.
The RECOM 3DPP technology means that dc-dc converter modules can be handled, placed and soldered like any other surface-mount component, but also offer as low a profile as today’s slim-line products. Products which feature 3DPP technology also have a small board footprint thanks to extension of the package in the vertical dimension, taking advantage of 3D assembly techniques.
This 3DPP technology is in use across a range of RECOM low-power dc-dc converter modules. The latest is the 1.0 W RxxC1TFxxS series isolated dc-dc converter. Featuring a 5 mm x 4 mm footprint and a low profile of just 1.18 mm, this module offers outstanding performance.
The isolation rating is 3 kV ac/1s, and it provides selectable 3.3 V or 5 V outputs from an input-voltage range of 3 V to 5.5 V. Operating in ambient temperatures up to 125°C with derating, the RxxC1TFxxS is ideal for applications including COM port isolation, industrial automation equipment, IoT devices, and sensor isolation.