System-in-package with integrated features saves space in automotive motor controllers

Infineon has introduced the MOTIX™ TLE9954QSW40-33, a system-in-package (SiP) designed for brushless dc (BLDC) automotive applications. The SiP integrates a 32-bit Arm^® Cortex^®-M23 core, local interconnect network (LIN) transceiver, a three-phase gate driver, and six OptiMOS™ 7 power MOSFETs inside a single package. Combining all of these features into one package enables 2-layer PBCs and allows designers to reduce board footprint by up to 40% compared to standard designs.

The TLE9954QSW40-33 is part of the MOTIX™ family of low-voltage motor control solutions, and can be used to control automotive auxiliary drives such as pumps or fans, or compact smart motors, with one example being seat adjustment.

Several peripherals are included to support BLDC applications:

• Fast 12-bit analog-to-digital converters measuring up to 16 inputs
• Ten 16-bit timers and one 24-bit timer
• Low-side shunt current sense amplifier and comparator
• On-chip clock generation

Integrated Arm^® TrustZone^® technology provides hardware-based isolation of safety- and security-relevant functions for automotive applications. With AEC-Q100 Grade 0 qualification and support for ISO 26262 up to ASIL B, the MOTIX TLE9954QSW40-33 meets the reliability and safety requirements of modern automotive motor control applications. 

Measuring just 9.5mm x 9mm in a LIQFN-58-1 package, the SiP has an operating temperature range of -40°C to 175°C suitable for harsh conditions often found inside automobiles.

Designers using the SiP can get a head start using the MOTIX™ TLE994_5x Software Development Kit (SDK) which includes a peripheral driver library as well as boot, startup, and example code. The SDK is supported by Infineon Device Configurator plus Arm^® Keil and IAR IDEs for a development experience which is familiar to many engineers.