Automotive

STMicroelectronics

The STEVAL-MKI252KA evaluation kit is based on the IIS3DWBG1, ultrawide bandwidth, low-noise 3-axis digital vibration sensor with extended temperature range.

The evaluation kit includes a square sensing board with the IIS3DWBG1 mounted at the center, connected by flat cable to the STEVAL-MKIGIBV5 adapter board for compatibility with the STEVAL-MKI109D platform. The kit exposes the complete pinout and supports sensor configuration and communication through ST MEMS Studio.

Infineon

The OPTIGA™ Authenticate NBT Development Shield combines hardware components to allow evaluation and development of applications for the OPTIGA™ Authenticate NBT, NFC Type 4 asymmetric tag.

For activating and using shared e-bikes with NFC-enabled smart phones, locking and unlocking personal portable HDD drives with NFC-enabled smart phones, and healthcare applications involving data logging and secured data monitoring. The industrial applications involve configuration and parametrization of electric relay switches, circuit breakers and more.

Microchip

The EV18H47 (MCS MCLV-48V-300W) inverter board provides a platform for evaluating and prototyping motor control designs using the dsPIC33AK family. The board is designed to interface with motor control dual-in-line modules (DIMs) such as the EV67N21A, which houses the dsPIC33AK512MC510 DSC.

STMicroelectronics

The STEVAL-MKI243A is an adapter board designed to facilitate the evaluation of the ASM330LHHXG1 6-axis IMU (inertial measurement unit) in automotive applications. The board offers an effective solution for fast system prototyping and device evaluation directly within the user’s own application. 

The STEVAL-MKI243A can be plugged into a standard DIL24 socket. The adapter provides the complete ASM330LHHXG1 pinout and comes ready to use with the required decoupling capacitors on the VDD power supply line. 

This adapter is supported by the STEVAL-MKI109D evaluation platform, which includes a high-performance 32-bit microcontroller functioning as a bridge between the sensor and a PC, on which it is possible to use the downloadable MEMS Studio graphical user interface or dedicated software routines for customized applications.

STMicroelectronics

The AEK-POW-BMSCC is a compact battery management system module based on the L9963E, optimized for easy mounting in battery packs. It can be used in a centralized daisy-chain as an intermediate node, where the first node is an AEK-POW-BMSCCTX. As an intermediate node, the AEK-POW-BMSCC can be part of a chain of up to 31 BMS nodes.

Each module monitors between 4 and 14 cells and can serve as an intermediate node in a daisy chain of up to 31 BMS nodes. The board provides voltage, current, and temperature sensing for each cell, enabling precise State-of-Charge estimation and cell balancing across the pack. Part of ST’s AutoDevKit ecosystem, the AEK-POW-BMSCC allows engineers to quickly prototype scalable, high-voltage battery management solutions with support for functional safety and real-time monitoring.

Renesas

Renesas offers the EK-RA8P1 evaluation kit to support development with the RA8P1 MCU. This kit includes an RA8P1 board with on-board J-Link debugger and connectors for Ethernet, USB, audio, and displays, plus a 7-inch capacitive-touch LCD and 5MP camera module for human-machine interface and vision demos.

The EK-RA8P1 comes pre-loaded with example projects showcasing the MCU 1GHz performance in voice recognition, image capture, and real-time analytics, allowing engineers to rapidly evaluate RA8P1 features using the Renesas FSP middleware and e²Studio IDE.

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