Integrated matching network and filter IC optimizes wireless performance of Bluetooth and Zigbee radios

The MLPF-WB-02D3 IC from STMicroelectronics provides a ready-made impedance matching network and filter that optimize the RF performance of the STM32WB5x and STM32WB1x wireless microcontroller modules. 

The impedance network is matched to the STM32WB5x and STM32WB1x devices in wafer-level chip-scale or ball-grid array packages. The filter provides deep rejection of harmonics. 

The MLPF-WB-02D3 uses ST integrated passive devices (IPD) technology on a non-conductive glass substrate to provide outstanding RF performance. The device is supplied in a 1.6 mm x 1.0 mm chip-scale package with six bumps.