Power module streamlines digital rails with programmable circuit control and sequencing

The Monolithic Power Systems triple-output MPM54313 power module combines three buck rails, integrated inductors, and I2C programmability to simplify multi-rail power, with monitoring, sequencing, and flexible paralleling options.

The MPM54313 is a fully integrated, triple-output power module designed for dense digital loads that need multiple tightly regulated rails and fast transient response. The module uses adaptive constant-on-time (COT) control and integrates power-on and power-off sequencing, configurable soft-start and compensation, plus adjustable protection thresholds, reducing external components and tuning effort.

A key advantage is digital configurability. Output voltage can be set online via inter-integrated circuit (I2C) bus or pre-programmed using multiple-time programmable (MTP) memory, allowing the same hardware to be configured for different rail plans.

MPM54313 supports multiple ways to scale current without redesigning the power stage. It includes configurable active voltage positioning (AVP) to create droop for passive current sharing when paralleling up to three outputs. In addition, buck A and buck B can be configured to operate in parallel for up to 6A using interleaving mode, providing active current balancing and improved ripple performance for higher-current rails. Differential remote sense pins support accurate regulation at the load. 

The module also adds telemetry and system-level control features that support monitoring of output voltage, output current, and junction temperature via I2C, provides open-drain power good (PG), and allows selection of pulse-frequency modulation (PFM) or pulse-width modulation (PWM) operating modes with frequency adjustment through I2C. Switching frequency is configurable from 500kHz to 1000kHz, enabling designers to trade-off efficiency and transient performance. 

The MPM54313 operates from 4V to 16V input, supports 0.4V to 5.5V output range, and is offered in a ball grid array (BGA) 8mm x 9mm x 2.58mm package.

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