FTM 24-viii articles
New wireless MCU eases development of smaller, more efficient smart Bluetooth devices
The STMicroelectronics STM32WB09 Bluetooth® wireless microcontroller supports the latest Bluetooth Low Energy 5.4 specification, enabling designers to implement advanced features such as real-time location finding and indoor positioning.
Miniature modem provides global LTE-M network coverage
The new Type 1SC cellular network module from Murata provides a ready-made radio system for machine-to-machine connectivity over LTE-M mobile phone networks, and has certificates for operation in most countries worldwide.
Distributed antenna system solutions enhance mobile signals indoors
The Pulse range of distributed antenna system (DAS) antennas from YAGEO offers a compact solution for extending cellular network coverage inside buildings, and gives broad frequency coverage up to 6 GHz.
Zero-voltage switching power supply ICs help reduce size of power adapters
The Power Integrations InnoSwitch™4-Pro flyback converter ICs achieve efficiency over 95%, and provide a new, more compact option for USB PD and Universal Fast Charging Specification adapters for loads up to 220 W.
Miniature diodes offer ESD protection up to ±30 kV
The Vishay VCUT and VBUS series of ESD protection diodes in a CLP0603-2L package save space in consumer, automotive and industrial applications, while providing a high level of immunity against high-voltage ESD strikes.
High security, minimal design disruption: how to choose the right hardware for compliance with new IoT cybersecurity regulations
By Nicolas Guilbaud
EMEA Business Development Manager (Cybersecurity), Future Electronics
Read this to find out about:
- New regulations governing cybersecurity, including additions to the Radio Equipment Directive, and the new Cybersecurity Resilience Act
- The company-wide implications of programs to ensure compliance with the regulations
- The three hardware options for implementing a security capability sufficient for compliance
Dev board for wireless MCU offers multiple expansion options
The NXP FRDM-MCXW71 is a ready-made platform to evaluate and develop with the MCX W71 wireless microcontrollers. Featuring Bluetooth®, Zigbee, Thread and Matter networking capability, the MCX W71 MCUs are backed by strong security capabilities.
Antenna offers high performance at 868 MHz ISM frequency
The ANT-868-JJB-ST from TE Connectivity is a dome antenna which offers long life and a robust mounting arrangement for use in IoT and industrial products such as scanners and energy meters.
Low-profile chip antennas boast robust performance for cutting-edge connected designs
NIC Components supplies a broad portfolio of compact surface-mount chip antennas, which offer stable and reliable operation across various standard frequency bands to support many applications.
Digital power monitor offers high-precision input channels and MIPI I3C interface
The TSC1641 from STMicroelectronics performs tightly synchronized voltage and current measurements and produces highly accurate power calculations. The I3C interface allows for direct connection to the latest 32-bit microcontrollers.
Power controller IC performs tight regulation of auxiliary power supplies
The BD28C5xH/LFJ-LB family of power controllers from ROHM Semiconductor is supplied in various versions to meet the different protection threshold requirements of silicon MOSFETs, IGBTs and silicon carbide MOSFETs.
Fuseholders support automated assembly and high safety
The SCHURTER OGN family of open-frame fuseholders meets high safety requirements, and features a robust construction to withstand high solder temperatures.
IEEE 802.3cg-compliant controller brings Ethernet to the edge of factory networks
The NCN26010 Ethernet controller from onsemi offers high noise immunity, maintaining reliable connectivity over a long range even in noisy industrial environments, and offers multiple node support to reduce the cost of installation.
Launch of high-performance wireless MCUs supports compliance with new cybersecurity regulations
The highly integrated STM32WB5 family from STMicroelectronics supports multiple wireless technologies and the latest security standards, addressing the market requirements for smart industrial, medical, and consumer devices.
Compact 2.4 GHz antenna produces high RF performance in wireless IoT applications
The surface-mount AMCA31-2R450G-S1F-T3 chip antenna from Abracon provides a linear polarized output for IoT and wearable devices that require a Wi-Fi® or Bluetooth® connection.
New 64-bit MPU boasts four RISC-V cores and supports real-time embedded applications
Microchip has launched the new PIC64 family of microprocessors, which offers power-efficient asymmetric multiprocessing and deterministic latency in real-time and bare-metal systems while simultaneously running the Linux® operating system.
Digital LEDs simplify design and reduce cost of low-power lighting arrays
The IN-PIS63BTPx family of red, green, blue and white LEDs from Inolux include an embedded controller and four pins to enable digital control signals to be passed from LED to LED in a simple daisy-chain configuration.
New low-profile rectifier IC offers footprint compatibility with legacy packages
The Vishay SExxNx series of PowerDFN DFN3820A surface-mount standard rectifiers supports maximum repetitive peak reverse voltages up to 600 V and continuous forward rectified currents up to 2 A.
New module provides complete Bluetooth Low Energy implementation in small footprint
The highly integrated PAN1783 wireless module from Panasonic is supplied with an onboard chip antenna. It features the latest Bluetooth® Low Energy capabilities including isochronous channels and audio streaming.
Ultra-compact connectors boast high-speed data transmission for compact end products
The high-performance BM28 connector series from Hirose Electric presents one of the lowest-profile flexible printed circuit (FPC) and board-mounted connector sets on the market, with a stacking height of just 0.6 mm.
Discrete security solution provides off-the-shelf Matter security for IoT devices
The OPTIGA™ Trust M MTR from Infineon combines the proven OPTIGA Trust M secure element with a Matter provisioning service. This flexible solution enables Matter-certified security to be added easily to existing IoT device designs.
New op amps bring high-accuracy sensing to industrial and automotive applications
The TSZ151 operational amplifiers from STMicroelectronics, which offer low offset and zero drift, provide wide gain bandwidth in, sensor interfacing, signal conditioning and power conversion circuits.
Miniaturized tuning fork crystal boosts battery life in industrial IoT designs
The ECX-16 32.768 kHz surface-mount tuning fork crystal from ECS Inc features an extended temperature range for industrial applications, and is recommended for use with STM32 microcontrollers and in LoRaWAN® devices.
Standard-compliant RS-485 transceivers for reliability in noisy industrial environments
The robust STMicroelectronics ST4E1240 and ST4E1216 transceiver ICs are ideal for factory automation equipment, industrial robots and telecoms infrastructure due to high signal integrity and integrated ESD protection.
High-power USB Type-C socket saves space not functionality in portable designs
The USB4205 and USB4210 USB Type-C® receptacles from GCT feature an innovative flag-type design with sideband contacts for audio accessory and alternate modes.
New level shifters support wide voltage range and high data rates while saving power
Nexperia has introduced the NXU0304 4-bit dual-supply translator ICs, which offer three-state operation, a wide shifting range from 0.9 V to 5.5 V, and robust communications at up to 250 Mbits/s.
New multi-sensor module integrates AI for next-level air quality monitoring
Renesas enables combined air quality measurements with the new RRH62000 all-in-one sensor module, which delivers critical air quality insights in a 46.6 mm x 34.8 mm x 12 mm package.
Low-cost Bluetooth modules offer secure communications for smart applications
Microchip presents the WBZ35x family of wireless modules, which feature a 32-bit Arm® Cortex®-M4F processor, a fully compliant Bluetooth® Low Energy 5.2 transceiver, and a comprehensive range of peripherals.
Latest SiC merged-pin Schottky diodes offer improved efficiency and easy paralleling
Vishay has launched the third generation of silicon carbide (SiC) Schottky diodes, which exhibit almost no reverse-recovery tail, no switching losses, and temperature-independent switching behavior at up to 175°C.
New wireless chipsets combine Wi-Fi 6 and Bluetooth connectivity in a single chip
Infineon has launched the AIROC™ CYW5551x series, which offers the advanced features of the latest Wi-Fi® 6 and Bluetooth® v5.4 specifications, and will be available in an easy-to-integrate Type 2FY module from Murata.
Transformer modules streamline Ethernet connectivity in industrial designs
The HB and HXB series of highly integrated Ethernet isolation modules from Pulse Electronics, a YAGEO company, are compatible with all major PHYs and offer surface-mount and through-hole package options.
IrDA infrared transceiver modules extend battery life with ultra-low idle current
The TF family of infrared (IR) transceiver modules from Vishay comply with the latest IrDA physical layer specification, and offer data rates up to 115.2 kbits/s at a link distance of 1 m.
Reverse-polarity SMA connectors promote safety by opposing untested antennas
The CONREVSMA connectors by TE Connectivity offer a standard SMA jack and plug with a reversed center pin. This prevents unwanted connections while still allowing engineers to use existing tooling.
100 W USB PD sink power controller with flexible management and protection features
The STMicroelectronics STUSB4500, which can operate in stand-alone mode with no need for a microcontroller, can be used in USB Type-C® connections, and is backed by a comprehensive set of protection functions.
IP67-rated tactile switches offer precise specification for electrical height
Littelfuse has tightened the specification for the distance between the KSC2 switches’ actuation point and the bottom contact, to enable more precise board assembly in end products.