Wireless communications

Nordic Semiconductor

The nRF54L15 DK development kit provides a hardware and software platform for evaluation of all three wireless systems-on-chip (SoCs) in the nRF54L series from Nordic Semiconductor. The nRF54L15 is on the development board, while the nRF54L10 and nRF54L05 can be emulated. 

The nRF54L15 DK is supported by a comprehensive set of nRF Connect tools and by the nRF Connect software development kit (SDK). Developers can explore the full potential of the nRF54L15 SoC using the extensive range of software samples, modules, and libraries available in the SDK.

STMicroelectronics

The NUCLEO-WBA65RI from STMicroelectronics is a wireless board which demonstrates the ultra low-power radio in the STM32WBA6 series wireless MCUs. The multi-protocol versions of the STM32WBA6 series support the Bluetooth® Low Energy networking, Thread, Matter, and Zigbee protocols, as well as providing IEEE 802.15.4-2015 signaling capability.

The board’s ARDUINO Uno V3 and ST morpho headers allow for easy expansion of the functionality of the STM32 Nucleo open development platform with a wide choice of specialized shields.

 

Other features include: 

  • Three user LEDs
  • Three user and one reset push buttons
  • USB Type-C® connector 
  • Comprehensive free software libraries and examples available with the STM32CubeWBA MCU package
STMicroelectronics

The B-WBA5M-WPAN STM32WBA connectivity expansion board from STMicroelectronics provides a flexible way to evaluate the STM32WBA5MMGH6 module.

The board includes a USB Type-C® connector for power only. It also integrates an M.2 E‑Key connector, turning it into an M.2 E‑Key daughterboard which provides a Bluetooth® interface to a host board that has an M.2 E‑Key host connector. The M.2 E‑Key connector is compatible with the PCI-SIG standard, and provides UART, SPI, I2C, and SAI interfaces for communication with the host.

The B-WBA5M-WPAN board is supported by the STM32CubeWBA software package. 

 

Key features include: 

  • 256 kbit serial EEPROM
  • Accurate MEMS temperature sensor
  • 3D accelerometer and 3D gyroscope
  • User LED
  • User and reset push buttons
Renesas

The Bluetooth Low Energy Development Kit Pro for the DA14533 SmartBond TINY automotive system-on-chip (SoC) from Renesas includes a motherboard, daughterboard, and cables. It is the ideal platform for evaluating the performance of the small, low-power DA14533 in applications such as tire pressure monitoring and passive keyless entry. 

The kit provides users with the following capabilities:

  • Software development
  • Programming the DA14533 via JTAG or UART using the DA1453x software development kit supplied by Renesas
  • RF characterization
  • Hardware prototyping
  • Power measurement
  • 2 x auxiliary voltage/current measurement
  • Monitoring eight digital inputs 
  • Connecting MikroBUSâ„¢ modules
Infineon

This kit provides a development platform for the Sona™ IF513 module from Ezurio, which is based on the CYW55513 Wi-Fi 6/Bluetooth wireless chipset from Infineon. 

Key features: 

  • Antenna type: 2 x MHF4L connector for antenna diversity
  • Form factor: pluggable M.2 2230 E-Key 
  • Frequencies supported: 2.4 GHz/ 5 GHz /6 GHz
  • Wireless technologies: Wi-Fi 6E, Bluetooth 6.0



Infineon

The EVK-MAYA-W381 from u-blox provides a ready-made application environment for designers working with the MAYA-W381, a module which is based on the CYW55513 Wi-Fi 6/Bluetooth wireless chipset from Infineon. The module provides two external antennas for tri-band Wi-Fi 6/6E and Bluetooth 6.0 connectivity. 

 

Key features of the EVK-MAYA-W381 include:  

  • SD card adapters to access the SDIO host interface
  • USB interface to easily access the Bluetooth UART interface via a USB-to-UART bridge
  • Digital and analog audio interfaces for Bluetooth wireless networks 
  • SMA connectors for external antennas
  • GPIO pins and other module interfaces accessible through pin headers
  • Multiple power-supply options
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