This kit provides a development platform for the Sona™ IF513 module from Ezurio, which is based on the CYW55513 Wi-Fi 6/Bluetooth wireless chipset from Infineon.
Key features:
The EVK-MAYA-W381 from u-blox provides a ready-made application environment for designers working with the MAYA-W381, a module which is based on the CYW55513 Wi-Fi 6/Bluetooth wireless chipset from Infineon. The module provides two external antennas for tri-band Wi-Fi 6/6E and Bluetooth 6.0 connectivity.
Key features of the EVK-MAYA-W381 include:
Evaluation board, EVAL-6EDL04I065PR, features Infineon’s latest silicon-in-insulator (SOI) EiceDRVIER™ gate driver IC, 6EDL04I065PR, and TRENCHSTOP™ Reverse Conducting (RC) IGBT, IKD06N60RC2, in a compact, cost-effective three-phase inverter bridge designed to drive a brushless direct current (BLDC) motor.
Infineon´s XENSIV™ TLx5012B magnetic angle sensor 2GO kit is a budget-priced entry level evaluation kit equipped with a TLE5012B /TLI5012B digital GMR angle sensor interfaced with an XMC1100 Infineon Microcontroller based on ARM Cortex M0 CPU.
The KIT_PSC3M5_EVK is an evaluation board for the Infineon PSOC™ Control C3 family of microcontrollers.
The kit features PSOC Control C3M5, a high-performance and low-power single-core Arm® Cortex® M33-based MCU intended for use in motor-control applications. In addition to the CPU subsystem, the chip contains advanced real-time control peripherals, such as a high-performance programmable analog subsystem, comparators, advanced timers with high-resolution capability, up to six serial communication blocks, and two CAN FD interfaces for system communication.
The AIROC™ CYW20829 Bluetooth® LE MCU Evaluation Kit (CYW920829M2EVK-02) with its included on-board peripherals enables evaluation, prototyping, and development of a wide array of Bluetooth Low Energy applications, all on Infineon’s low power, high performance AIROC CYW20829.
