STMicroelectronics

The STEVAL-56G3MAI module enables easy evaluation of the VD56G3 1.5 Mpixel monochrome image sensor from STMicroelectronics. The module features a soldered sensor, an M12 lens holder screwed to the board, and a removable lens. The module also has a flex cable to connect to a broad range of embedded processing platforms. 

The module is one of a family of modules for evaluating various products in the ST BrightSense image sensor portfolio. All share the same standard connector and pinout, to enable easy replacement of one image sensor with another in proof-of-concept designs. 

All of the image sensor modules are backed by a comprehensive set of enablement software, drivers and evaluation tools, including drivers for a Linux® operating system. The modules also support GUI software for evaluation when paired with the ST EVK Main board.

STMicroelectronics

The STM32 Nucleo-64 board for the STMicroelectronics STM32U3 series of ultra low-power microcontrollers provides an affordable and flexible way for users to try out new concepts and build prototypes.

 

onsemi

The AF0130CSSM30SMKAH3-GEVK evaluation board from onsemi combines an indirect time-of-flight (iToF) sensor board, featuring the AF0130 1.2 Mpixel global-shutter sensor, with a laser driver board for programming the modulation settings of the sensor’s VCSEL emitters.

The sensor board can be interfaced to a Demo3 evaluation board. The combined kit uses the popular DevSuite software from onsemi to configure the system. The software provides a comprehensive set-up interface, and offers flexible ways to evaluate the sensor’s features and capabilities.

STMicroelectronics

The X-NUCLEO-53L4A3 from STMicroelectronics is an expansion board for any STM32 Nucleo board equipped with Arduino R3 connectors which enables designers to develop applications using the VL53L4ED short-range time-of-flight (ToF) proximity sensor.

The expansion board is supplied with a cover glass holder in which designers can fit a spacer of 0.25 mm, 0.5 mm, and 1 mm height below the cover glass to simulate a variety of air gaps. A small oval cover glass fitting the sensor is included.

The kit includes:

  • Two different cover glass units to protect the sensor from dust
  • Compatible with STM32 Nucleo development boards
  • Equipped with Arduino® UNO R3 connectors
  • Full system software, including code examples and a graphical user interface
Renesas

The ZSSC3286KIT evaluation kit from Renesas provides the hardware needed for the configuration, calibration, and evaluation of the IO-Link ready ZSSC3286 sensor signal conditioner (SSC) IC. 

The user’s PC can communicate via USB with the ZSSC3286 IC on the ZSSC3286 evaluation board via IO-Link, using the included RH4Z2501-PMOD board, an IO-Link physical layer transceiver board with a Pmodâ„¢ interface, and the 2-channel IO-Link master. 

The ZSSC3286 evaluation kit also contains a sensor signal conditioning communication board for configuration via an I²C interface.

The ZSSC3286KIT is an all-in-one evaluation system which includes:

  • ZSSC3286 evaluation board
  • SSC communication board
  • SSC sensor replacement board
  • CCE4510 IO-Link master board
  • RH4Z2501-PMOD board
  • Five ZSSC3286 samples
  • USB and IO-Link cables
  • Tweezers
  • Software including ZSSC3286 IO-Link Device Description generator
Infineon

This kit provides a development platform for the Sona™ IF513 module from Ezurio, which is based on the CYW55513 Wi-Fi 6/Bluetooth wireless chipset from Infineon. 

Key features: 

  • Antenna type: 2 x MHF4L connector for antenna diversity
  • Form factor: pluggable M.2 2230 E-Key 
  • Frequencies supported: 2.4 GHz/ 5 GHz /6 GHz
  • Wireless technologies: Wi-Fi 6E, Bluetooth 6.0



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