Bidirectional topologies for fast charging of EVs: options to optimize for size, power, cost or simplicity

By Riccardo Collura
EMEA Vertical Segment Manager (Power), Future Electronics

Read this to find out about: 

  • Why new dc charger designs have to contend with the challenges of power density and thermal management
  • The advantages and drawbacks of various topologies for implementing the PFC and dc-dc converter stages 
  • How reference designs from SiC MOSFET manufacturers provide a fast start for power-system designers who are developing new dc charger designs
Future Electronics



We are demonstrating with our partner TE Connectivity & Abracon what we are able to support on top of regular semiconductor for embedded systems (mainly processors & FPGAs) :


Connector (USB, Ethernet w/wo Magnetics, MINI HDMI)

Power modules

Memory headers (DIMM, SDCARD)

Heater & FAN

Battery holder


Our system solution approach will help our customers to save time and to ensure best fit regarding

  • time to market
  • availability & price
  • technical requirement
  • longevity (commercial)



Thanks to our Design for Resilience program we are also capable to provide cross references at R&D stage to quickly multisource your bill of material (BOM). This ensure your hardware is more “resilient” against supply chain disruption that may happen again.

A dedicated experienced Interconnect and Electromechanical team is able to assist, support across the entire journey.


System Solution Expertise 

Future Electronics Field application engineers are able to support you on all aspect of your embedded system, finetune choices, multisource them and ensure everything works well together.

We have an extended partnership with most of the key component suppliers (semiconductor, passive, interconnect / electromechanical, modules).

Simplicity and efficiency: 1,700 V integrated flyback controllers based on SiC MOSFET technology set a new trend

By Akif Hakki Polat
Eastern Europe Analog and Power Specialist Field Application Engineer, Future Electronics

Read this to find out about: 

  • The drawbacks of a discrete approach to high-voltage flyback converter design
  • The case for using an integrated SiC flyback controller with internal 1,700 V MOSFET
  • A comparison of 1,700 V-rated integrated flyback controllers from Power Integrations and ROHM Semiconductor

Simpler, cheaper, faster: the case for TSN in factory automation networks grows stronger by the day

Read this to find out about:

  • The features of the TSN variant of the Ethernet protocol which make it attractive to the industrial equipment sector
  • The IEEE standards which define the TSN specification
  • The reasons for using either discrete or SoC versions of the key TSN components – switches and transceivers

An easier way to design GaN-based power systems: comparing the market’s integrated driver offerings

By Vito Prezioso, Power Specialist Field Applications Engineer, Future Electronics (Northern Europe)

Future Electronics

The Avalanche development kit from Future Electronics provides a full-featured system environment for the development of applications based on the mid-range PolarFire FPGA from Microchip, a device which is notable for its low-power operation, security capabilities, and immunity to single-event upsets.