Near infrared imaging: new 3D sensing technology lowers cost and simplifies hardware architecture

By Abhishek Gadgi
EMEA Specialist Field Application Engineer (Imaging Solutions), Future Electronics

 Read this to find out about: 

  • The uses for NIR imaging in industrial applications
  • The range of techniques used to generate 3D images in the NIR spectrum
  • The latest emitter and sensor products for NIR applications available from specialist manufacturer ams OSRAM

Why MCU users can benefit from exploring the scope to use a low-end FPGA

By Patrice Brossard

EMEA Vertical Segment Manager (FPGAs and ASICs), Future Electronics

How to make your embedded system design more resilient in the face of supply-chain disruption

Read this to find out about: 

  • Why a supply chain that includes advanced microprocessor chips is vulnerable to disruption
  • How use of an off-the-shelf system-on-module insulates the OEM from supply-chain as well as design risks
  • The advantages of the new OSM standard form factors now supported by leading SOM manufacturers

Bidirectional topologies for fast charging of EVs: options to optimize for size, power, cost or simplicity

By Riccardo Collura
EMEA Vertical Segment Manager (Power), Future Electronics

Read this to find out about: 

  • Why new dc charger designs have to contend with the challenges of power density and thermal management
  • The advantages and drawbacks of various topologies for implementing the PFC and dc-dc converter stages 
  • How reference designs from SiC MOSFET manufacturers provide a fast start for power-system designers who are developing new dc charger designs
Future Electronics

We are demonstrating with our partner TE Connectivity & Abracon what we are able to support on top of regular semiconductor for embedded systems (mainly processors & FPGAs) :

Simplicity and efficiency: 1,700 V integrated flyback controllers based on SiC MOSFET technology set a new trend

By Akif Hakki Polat
Eastern Europe Analog and Power Specialist Field Application Engineer, Future Electronics

Read this to find out about: 

  • The drawbacks of a discrete approach to high-voltage flyback converter design
  • The case for using an integrated SiC flyback controller with internal 1,700 V MOSFET
  • A comparison of 1,700 V-rated integrated flyback controllers from Power Integrations and ROHM Semiconductor