STMicroelectronics

The CAM-55G1 modules from STMicroelectronics provide a ready-made camera system for evaluation and integration of the VD55G1 0.56 Mpixel monochrome image sensor. These ready-to-use cameras combine a VD55G1 sensor, lens holder, lens, and flexible printed circuit (FPC) connection, integrated into a single module as small as 5.0 mm2.

Multiple GPIOs enable users to synchronize the modules with triggers and an illumination source. Featuring a single-lane MIPI CSI-2 output, the modules are perfectly suited for low-power embedded vision applications.

The CAM-55G1 cameras are supplied with a choice of lenses to match the needs of various applications, providing different options for optical set-up and mechanical specifications. All camera modules are equipped with the same FPC-to-board connector and pin-out. This plug-and-play architecture allows users to change their choice of module, and re-use the same set-up with different lenses, color options and even different image sensors from the ST BrightSense portfolio.

The modules are backed by a comprehensive set of free enablement software, drivers and evaluation tools, including drivers for a Linux^® operating system.

The EVK Main is a versatile hardware kit which enables engineers to evaluate any ST BrightSense image sensor or associated evaluation promodule, including the CAM-56G3, on a computer. This comprehensive evaluation solution includes an EVK Main board with a USB Type-C® output and a mechanical holder for stable image capture.

The CAM-56G3 modules from STMicroelectronics provide a ready-made camera system for evaluation and integration of the VD56G3 1.5 Mpixel monochrome image sensor. These ready-to-use cameras combine a VD56G3 image sensor, lens holder, lens, and flexible printed circuit connection, integrated into a single module as small as 6.5 mm².

Multiple GPIOs enable users to synchronize the modules with triggers and illumination. Featuring a MIPI CSI-2 output interface, the modules are ideally suited for use in low-power embedded systems.

The VD56G3 image sensor on which the camera modules are based provides outstanding performance in the visible and near infrared portions of the spectrum. Featuring a proprietary ST pixel design, the image sensor offers a broad toolbox of on-chip functions which include features for optimizing data size and frame rates, such as crop, binning, and programmable sequences.

The sensor is supplied by ST as a bare die, so the CAM-56G3 modules provide an easier integration option for OEMs. The modules are backed by a comprehensive set of enablement software, drivers and evaluation tools, including drivers for a Linux^® operating system.

The P-NUCLEO-53L8A1 from STMicroelectronics is a complete evaluation kit for learning about, evaluating, and developing applications with the VL53L8 series of direct time-of-flight (ToF) sensors.